IEC IEC 60749-3 Edition 2.02017-03 INTERNATIONAL STANDARD Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination IEC 60749-3:2017-03(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright @ 2017 IEC, Geneva, Switzerland or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC yourlocal IECmemberNational Committeeforfurther information. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varembé Fax: +4122919 03 00 CH-1211 Geneva 20 [email protected] Switzerland www.iec.ch About the IEC International Standards for all electrical, electronic and related technologies About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition,acorrigendaoranamendmentmight havebeenpublished. IEcCatalogue-webstore.iec.ch/catalogue Electropedia-www.electropedia.org Thestand-alone application for consulting theentire The world's leading online dictionary of electronic and bibliographical information on IEc International Standards, electrical terms containing 20 000 terms and definitions in Technical Specifications, Technical_ Reports. and other English and French, with equivalent terms in 16 additional documents.Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical iPad Vocabulary(IEV)online. IECpublicationssearch-www.iec.ch/searchpub IEc Glossary - std.iec.ch/glossary The advanced search enables to find IEC publications by a 65 000 electrotechnical terminology entries in English and varietyofcriteria(reference number, text,technical French extracted from the Terms and Definitions clause of committee,..). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC JustPublished-webstore.iec.ch/justpublished Stay up to date on all new IEC publications.Just Published IECCustomerServiceCentre-webstore.iec.ch/csc details all new publications released. Available online and If you wish to give us your feedback on this publication or also once a month by email. need further assistance, please contact the Customer Service Centre: [email protected]. IEC IEC 60749-3 Edition 2.02017-03 NTERNATIONAL STANDARD Semiconductor devices - Mechanical and climatic test methods - Part3:Externalvisualexamination INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS31.080.01 ISBN 978-2-8322-4001-4 Warning! Make sure that you obtained this publication from an authorized distributor. ? Registered trademark of the International Electrotechnical Commission IEC 60749-3:2017@IEC 2017 - 2 - CONTENTS FOREWORD. 3 1 Scope .5 2 Normativereferences 3 Terms and definitions 5 4 Test apparatus 5 5 Procedure. 6 Failure criteria . ..6 7 Summary. ..6 Annex A (informative) External visual report form/checklist (example only - not a mandatory template), A.1 Leads... A.2 Lead finish .. ..8 A.3 Moulding and mould compound .8 A.4 Critical sealant. 9 A.5 Attachments. .9 A.6 Marking.. 9 A.7 Solder Balls 10 A.8 Substrate 10 A.9 Exposed (Backside) Silicon 10 Bibliography - 3 - IEC 60749-3:2017 @ IEC 2017 INTERNATIONAL ELECTROTECHNICAL COMMISSION SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - Part 3: External visual examination FOREWORD The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). .The, object of. IEC is to promote this end and in addition to other activities,IEC publishes International Standards,Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "TEC Publication(s)") Their preparation is entrusted to