全网唯一标准王
IEC IEEE IEC 63003 Edition 1.02015-12 IEEE Std 1505.1TM INTERNATIONAL STANDARD colour nside Standard for the common test interface pin map configuration for high-density, single-tierelectronics test requirements utilizingIEEE Std 1505TM IEC 63003:2015-12(en) IEEE Std 1505.1-2008 THISPUBLICATIONIS COPYRIGHT PROTECTED Copyright@2008IEEE All rights reserved. IEEE is a registered trademark in the U.S. Patent & Trademark Office, owned by the Institute of or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the IEC Central Office. Any questions about IEEE copyright should be addressed to the IEEE. Enquiries about obtaining additional rights to this publication and other information requests should be addressed to the IEC or yourlocal IEC member National Committee IECCentral Office Institute of Electrical and Electronics Engineers, Inc. 3, rue de Varembe 3 Park Avenue CH-1211 Geneva 20 NewYork, NY10016-5997 Switzerland United States of America Tel.: +41 22 919 02 11 [email protected] Fax: +41 22 919 03 00 www.ieee.org [email protected] www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. IEc Catalogue -webstore.iec.ch/catalogue Electropedia-www.electropedia.org Thestand-aloneapplication for consulting the entire The world's leading online dictionary of electronic and bibliographical information on IEC International Standards, electrical terms containing more than 30 000 terms and Technical Specifications, Technical Reportsandother definitions in English and French, with equivalent terms in 15 documents. Available for PC, Mac OS, Android Tablets and additional languages. Alsoknown as theInternational iPad. Electrotechnical Vocabulary (IEV) online. IEC publications search-www.iec.ch/searchpub IEC Glossary - std.iec.ch/glossary The advanced search enables to find IEC publications by a More than 60 000 electrotechnical terminology entries in varietyofcriteria(reference number, text,technical English and French extracted from the Terms and Definitions committee,..). It also gives information on projects, replaced clause of IEC publications issued since 2002. Some entries and withdrawn publications. have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEc Just Published -webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published IECCustomerServiceCentre-webstore.iec.ch/csc If you wish to give us your feedback on this publication or details all new publications released. Available online and also once a month by email. need further assistance, please contact the Customer Service Centre: [email protected]. IEC IEC 63003 Edition1.02015-12 INTERNATIONAL IEEE Std 1505.1TM STANDARD colour inside Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505TM INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 25.040 ISBN 978-2-8322-2941-5 Warning! Make sure that you obtained this publication from an authorized distributor.

.pdf文档 IEC 63003 2015 Standard for the common test interface pin map configuration for high-density single-tier electronics test requirements utilizing IEEE Std 1505 trade

文档预览
中文文档 88 页 50 下载 1000 浏览 0 评论 309 收藏 3.0分
温馨提示:本文档共88页,可预览 3 页,如浏览全部内容或当前文档出现乱码,可开通会员下载原始文档
IEC 63003 2015 Standard for the common test interface pin map configuration for high-density single-tier electronics test requirements utilizing IEEE Std 1505 trade  第 1 页 IEC 63003 2015 Standard for the common test interface pin map configuration for high-density single-tier electronics test requirements utilizing IEEE Std 1505 trade  第 2 页 IEC 63003 2015 Standard for the common test interface pin map configuration for high-density single-tier electronics test requirements utilizing IEEE Std 1505 trade  第 3 页
下载文档到电脑,方便使用
本文档由 人生无常 于 2025-05-10 09:13:27上传分享
友情链接
站内资源均来自网友分享或网络收集整理,若无意中侵犯到您的权利,敬请联系我们微信(点击查看客服),我们将及时删除相关资源。