EUROPEAN STANDARD EN IEC 61189-2-720 NORMEEUROPEENNE EUROPAISCHENORM April 2024 ICS 31.180 English Version Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 61189-2-720:2024) Methodes d'essai pourles materiaux électriques, les cartes Prufverfahren fur elektrische Materialien, Leiterplatten und imprimees et autres structures dinterconnexion et andere Verbindungsstrukturen und -Baugruppen - Teil 2- 720: Erkennung von Fehlern in Verbindungsstrukturen ensembles -Partie 2-720 : Détection de defauts présents dans les structures d'interconnexion par mesurage de la durchMessungderKapazitat capacite (IEC 61189-2-720:2024) (IEC 61189-2-720:2024) This European Standard was approved by CENELEC on 2024-04-10. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management CentreortoanyCENELECmember. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are thenational electrotechnical committees of Austria, Belgium,Bulgaria, Croatia, Cyprus,the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkiye and the United Kingdom CENELEC European Committee for Electrotechnical Standardization Comite Europeen de Normalisation Electrotechnique Europaisches Komitee fuir Elektrotechnische Normung CEN-CENELECManagementCentre:RuedelaScience23,B-1040Brussels Ref.No.ENIEC 61189-2-720:2024 E EN IEC 61189-2-720:2024 (E) European foreword The text of document 91/1923/FDIS, future edition 1 of IEC 61189-2-720, prepared by IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN IEC 61189-2-720:2024. The following dates are fixed: latest date by which the document has to be implemented at national (dop) 2025-01-10 level by publication of an identical national standard or by endorsement latest date by which the national the standards conflicting with (dow) 2027-04-10 document have to be withdrawn Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. complete listing of these bodies can be found on the CENELEC website. Endorsement notice The text of the International Standard IEC 61189-2-720:2024 was approved by CENELEC as a European Standard without any modification. 2 EN IEC 61189-2-720:2024 (E) Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cencenelec.eu. Publication Year Title EN/HD Year IEC 60194-2 Printed boards design
IEC 61189-2-720 2024 Test methods for electrical materials circuit boards and other interconnection structures and assemblies - Part 2-720 Detection of defects in interconnection structures by measure
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