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IEC 62047-31 2019 Semiconductor devices - Micro-electromechanical devices - Part 31 Four-point bending test method for interfacial adhesion energy of layered MEMS materials
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IEC 62047-31 2019 Semiconductor devices - Micro-electromechanical devices - Part 31 Four-point bending test method for interfacial adhesion energy of layered MEMS materials
